LDGM2641 data sheet ligitek electronics co.,ltd. property of ligitek only round type led lamps doc. no : qw0905-LDGM2641 rev. : a date : 29 - jul. - 2006 pb lead-free parts
30 60 0 100% 75% 50% 25% 0 25% -30 -60 100%75%50% ligitek electronics co.,ltd. property of ligitek only package dimensions 1/5 page LDGM2641 part no. note : 1.all dimension are in millimeter tolerance is 0.25mm unless otherwise noted. 2.specifications are subject to change without notice. directivity radiation + - 25.0min 3.1 2.9 0.5 typ 2.54typ 1.0min 1.5max 4.3 3.3
3.5 typ. v 150 esd electrostatic discharge( * ) color green transparent typical electrical & optical characteristics (ta=25 ) note : 1.the forward voltage data did not including 0.1v testing tolerance. 2. the luminous intensity data did not including 15% testing tolerance. ingan/gan material LDGM2641 part no green emitted operating temperature storage temperature dominant wave length dnm luminous intensity @20ma(mcd) viewing angle 2 1/2 (deg) forward voltage @20ma(v) spectral halfwidth nm 525 lens 36 4.0 max. 5501100 min. typ. 28 -30 ~ +100 tstg t opr -20 ~ +80 absolute maximum ratings at ta=25 forward current peak forward current duty 1/10@10khz reverse current @5v power dissipation parameter page 2/5 pd ir i fp i f 120 50 100 30 symbol ratings dgm ma ma a mw unit ligitek electronics co.,ltd. property of ligitek only peak wave length pnm 518 static electricity or power surge will damage the led. use of a conductive wrist band or anti-electrosatic glove is recommended when handing these led. all devices, equipment and machinery must be properly grounded. * LDGM2641 part no.
fig.3 forward voltage vs. temperature fig.5 relative intensity vs. wavelength ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a wavelength (nm) f o r w a r d v o l t a g e @ 2 0 m a n o r m a l i z e @ 2 5 fig.4 relative intensity vs. temperature ambient temperature( ) r e l a t i v e i n t e n s i t y @ 2 0 m a n o r m a l i z e @ 2 5 typical electro-optical characteristics curve forward voltage(v) fig.1 forward current vs. forward voltage f o r w a r d c u r r e n t ( m a ) forward current(ma) fig.2 relative intensity vs. forward current r e l a t i v e i n t e n s i t y n o r m a l i z e @ 2 0 m a ligitek electronics co.,ltd. property of ligitek only 1.0 0.1 1.0 10 100 1000 1.0101001000 0.0 0.5 1.0 1.5 2.0 2.5 3.0 -40-200204060 1.0 1.1 1.2 450550600 0.0 0.5 1.0 2.03.04.05.0 80100 0.8 0.9 -20 -40 40 20 080100 60 2.0 0.0 0.5 1.0 1.5 2.5 3.0 500 dgm chip 3/5 page LDGM2641 part no.
60 seconds max dip soldering preheat: 120 c max preheat time: 60seconds max ramp-up 2 c/sec(max) ramp-down:-5 c/sec(max) solder bath:260 c max dipping time:3 seconds max distance:2mm min(from solder joint to body) 2.wave soldering profile soldering condition(pb-free) 1.iron: soldering iron:30w max temperature 350 c max soldering time:3 seconds max(one time) distance:2mm min(from solder joint to body) ligitek electronics co.,ltd. property of ligitek only page 4/5 0 preheat 0 25 2 /sec max 100 50 150 time(sec) temp( c) 120 260 5 /sec max 260 c3sec max LDGM2641 part no.
the purpose of this is the resistance of the device which is laid under condition of low temperature for hours. the purpose of this test is the resistance of the device under tropical for hours. the purpose of this is the resistance of the device to sudden extreme changes in high and low temperature. this test intended to see soldering well performed or not. 1.ta=105 5 &-40 5 (10min) (10min) 2.total 10 cycles 1.t.sol=230 5 2.dwell time=5 1sec 1.t.sol=260 5 2.dwell time= 10 1sec. solder resistance test solderability test thermal shock test high temperature high humidity test 1.ta=65 5 2.rh=90%~95% 3.t=240hrs 2hrs this test intended to determine the thermal characteristic resistance of the device to sudden exposures at extreme changes in temperature when soldering the lead wire. mil-std-202: 210a mil-std-750: 2031 jis c 7021: a-1 mil-std-202: 208d mil-std-750: 2026 mil-std-883: 2003 jis c 7021: a-2 mil-std-202:103b jis c 7021: b-11 mil-std-202: 107d mil-std-750: 1051 mil-std-883: 1011 reliability test: ligitek electronics co.,ltd. property of ligitek only the purpose of this is the resistance of the device which is laid under condition of high temperature for hours. this test is conducted for the purpose of detemining the resistance of a part in electrical and themal stressed. test condition 1.ta=-40 5 2.t=1000 hrs (-24hrs, +72hrs) 1.ta=105 5 2.t=1000 hrs (-24hrs, +72hrs) 1.under room temperature 2.if=20ma 3.t=1000 hrs (-24hrs, +72hrs) high temperature storage test low temperature storage test operating life test test item description page 5/5 mil-std-750: 1026 mil-std-883: 1005 jis c 7021: b-1 jis c 7021: b-12 mil-std-883:1008 jis c 7021: b-10 reference standard LDGM2641 part no.
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